Advancing electronics have transformed armed forces’ ability to communicate and interfere with enemy communication lines. As a result, The electromagnetic spectrum has become a critical domain on the modern battlefield.

Electronic warfare capabilities are getting more sophisticated and complex, which is putting pressure on the ability of engineers to protect this sensitive equipment in some of the harshest and most extreme environments on earth. More powerful processors, higher clock cycles, and greater board density are all contributing to the need for more effective heat transfer. Robust thermal management in these systems are essential. Convection and forced air as cooling solutions are increasingly insufficient as demand on the thermal load rises.

nVent Schroff is a defense technology firm specialising in protecting ruggedized mission-critical military electronics on land, sea, air and space. In this webinar, experts from nVent Schroff, whose products have been used in major aerospace and defense systems around the world over the past five decades, will discuss:

• Why military electronics, processors and chips are getting smaller and hotter

• The heat path from the power-consuming board (PCB) elements to the chassis

• Innovations in thermal management at the PCB and cabinet level

• How AI will transform military electronics and how cooling solutions will need to adapt

Join Aerospace and Defense experts from nVent Schroff for what promises to be a lively and important conversation on 8 October 2024